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Visit of Óbuda University's Delegation at HIT
Delegation from Óbuda University in Hungary (the second largest university for applied sciences in Budapest) visited HIT - Holon Institute of Technology – on November 19, 2017.
Ádám Sziget - Cancellor ,László Korányi - Director for Innovation, Mátyás Kutni - Head of the Chancel7lor's Office and Szabolcs Szolnoki - Science and Tech Diplomat at the Hungarian Embassy in Tel Aviv visited the institute for the purpose of acquainting with HIT's new multidisciplinary R&D initiatives, academic innovation and tech transfer methodologies.
Prof. Eduard Yakubov, HIT president, mentioned in his opening remarks that science, research and innovation will be the base for future HIT–Óbuda University academic collaboration and partnership. Both institutions have identified global challenges in areas such as digital health, cyber and homeland security, big data, smart cities (mentioned in HIT Strategic plan) as opportunities for joint multinational R&D and academic activities.
With focus on future cooperation, the meeting was also attended by: Prof. David Shoikhet- Vice President for Academic Affairs, Prof. Ezra Zeheb- Dean of the Faculty of Sciences, Prof. Arik Sadeh- Dean of the Faculty of Technology Management, Mr. Samuel Goldberg– CEO, Dr. Refael Barkan- Head of R&D and External Relations Authority, Mr. Dimitry Patashov- Faculty of Sciences, Dr. Nissim Harel- Faculty of Sciences, Mr. Uri Or-Luka– Head of Industrial Design Department at the Faculty of Design, Mr. Mark Israel – GIS Lab at the Faculty of Sciences, Mrs.Tony Levy - External Relations Officer(ERO) at the President's office.
The fields of priority of bilateral cooperation between HIT and Obuda University will be focused on cyber security, digital health and design, utilizing R&D and academic platforms such as Horizon2020, ERASMUS+ EU Programs and bi-national funds.
Dr. Refael Barkan kindly invited the guests to enrich their insights from the Institute's activities by visiting HIT's innovative research centers and laboratories.
Published: 21.11.17
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